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Package footprint/dimensions can be found in the ESP32-PICO-D4 Datasheet.
The ESP32-based Wi-Fi/Bluetooth communication modules in the table below are surface-mount devices (SMD).
For information on the ESP31B prototype/beta chip, visit the Historical page.
ESP32-PICO-D4 Si P (system in package) module is housed in a 7×7 mm² Quad-Flat No-leads (QFN) package with 48 1 connection pads (48 pads along the sides and one large thermal pad connected to ground on the bottom).
Note to the beginner: If you are just getting started and don't know what to purchase, it would probably be best for you to purchase a development board (instead of an surface-mount module) for easier hardware setup and an better first time experience.All ESP32 chips thus far have been manufactured using TSMC's ultra-low power 40 The Processor Cores column above lists number of cores for the central processor; this number excludes the ULP co-processor.See ECO (Engineering Change Order) and Workarounds for Bugs in ESP32 for differences between revision 0 and revision 1.Before ordering, read all product descriptions and check vendor ratings when possible.Prices listed below are approximate and do not include shipping costs.